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Shenzhen Found Printed Circuit Board Co., Ltd.
Shenzhen Found Printed Circuit Board Co., Ltd.
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PCB Assembly for High Quality Multilayer Rigid PCB Board PCB Assembly Service

Shenzhen Found Printed Circuit Board Co., Ltd.

PCB Assembly for High Quality Multilayer Rigid PCB Board PCB Assembly Service

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Brand Name : Found

Model Number : fd09

Certification : UL E361831 ISO9001 TS16949

Place of Origin : China

MOQ : 1PC

Price : Negotiable

Payment Terms : T/T

Supply Ability : 100000PC

Delivery Time : 2-8 days

Packaging Details : Vacuum Packing

Copper thickness : 1/2OZ 1OZ 2OZ 3OZ

Base material : Aluminum

Min. line spacing : 0.1mm4mil)

Board thickness : 0.5~3.2mm

Min. line width : 0.1mm/4mi

Min. hole size : 4mil

Surface finishing : HASL Lead Free

Product name : shenzhen sunsoar pcb assembly from SMT

Type : Lithium Battery BMS

Application : Industry/Medical/Consumer electronic

Solder mask color : Blue.green.red.black.white.etc

Material : FR4 CEM1 CEM3 Hight TG

Solder mask : green/black/white/red/blue etc.

Usage : Plants Growing light

Item : pcb assembly

Pcb test : Flying probe and AOI (Default)/Fixture Test

Service : PCB&PCBA

Plugging vias capability : 0.2-0.8mm

Pcb assembly method : SMT

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PCB Assembly for Multilayer Rigid PCB Board PCB Assembly Service

PCB Assembly for High Quality Multilayer Rigid PCB Board PCB Assembly Service

Trade Terms:
1. Payment: T/T in advance (Western Union , payple is welcomed)
2. Production lead time 100PCS: 5-7days, 500~1000PCS: 7-10days, above 1000PCS 15-20days.
3. Sample can be delivered in 3days
4. Shipping freight are quoted under your requests
5. Shipping port: Shen zhen,Mainland China
6. Discounts are offered based on order quantities
7. MOQ: 1PCS
Package &Shipping Methods:
1.Vacuum package with silica gel, Carton box with packing belt.
2. By DHL, UPS, FedEx, TNT
3. By EMS (Usually for Russia Clients)
4. By sea for mass quantity according to customer's requirement

PCB Manufacture Capability
Item Manufacture Capability
Layers 1-26 Layers
HDI 2+N+2
Material Types Fr-4,Fr-5,High-Tg,Aluminum Based , Halogen Free,
Isola,Taconic,Arlon,Teflon,Rogers,
Max.Panel Dimension 39000mil * 47000mil (1000mm * 1200mm)
Outline Tolerance ± 4mil (± 0.10mm)
Board Thickness 8mil-236mil (0.2 - 6.0mm)
Board Thickness Tolerance ± 10%
Dielectric Thickness 3mil-8mil ( 0.075mm-0.20mm)
Min.Track Width 3mil ( 0.075mm )
Min.Track Space 3mil ( 0.075mm )
External Cu Thickness 0.5 OZ - 10 OZ ( 17um - 350um)
Internal Cu Thickness 0.5OZ - 6OZ ( 17um - 210um)
Drilling Bit Size ( CNC ) 6mil-256mil ( 0.15mm - 6.50mm)
Finished Hole Dimension 4mil-236mil(0.1mm - 6.0mm)
Hole Tolerance ± 2mil (± 0.05mm)
Laser Drilling Hole Size 4mil(0.1mm)
Aspect Ration 16: 1
Solder Mask Green,Blue,White,Black,Red,Yellow,Purple,etc.
Min Solder mask Bridge 2mil(0.050mm)
Plugged Hole Diameter 8mil-20mil ( 0.20mm-0.50mm)
Beveling 30o - 45o
V-scoring +/-0.1mm,15o30o45o60o
Impedance Control Min. 5%General10%
Surface Finishing HASL,HASL(lead Free),Immersion Gold
Immersion Silver,OSP,Hard Gold ( up to 100u" )
Certification UL RoHS ISO9001: 2000 ISO14000: 2004 SGS
Quality Standards Accept spcifications of customer and IPC(class II or III)



Features and benefits
1. The dielectric constant (DK) is low and stable, so the signal transmission is good without delay.
2. The characteristic of low dielectric loss makes the signal loss at a lower level, which makes the signal
transmission of the whole equipment excellent.
3. Delamination of copper foil will not be caused by the change of cold and heat due to the consistency
with the thermal expansion coefficient of copper foil.
4. Immersion gold has excellent surface planarity, particularly helpful for PCBs with BGA packages or even CSP mounted components to reduce failure rate during assembly and soldering.
5. UL, ISO certified PCB manufacturing factory.
6. Make delivery on time keeping 98% on-time-delivery rate.
7. Eligible products rate of first production: >95%
8. Experienced sales persons provide skilled customer services.
9. Fast and flexible to save the time of production from prototype to standard production

PRODUCTION CAPACITY

Items Parameter Special
Layers Counts 2-20
Board material FR-4,Aluminum High Tg FR4
max Fabrication area 580×700mm 500mm×3000mm
Board thickness 0.1-3.2mm
Camber Double Side
multi -layers
d ≤0.075mm
d ≤1%
d≤0.05mm
Impedance ±7% ±5%
PTH tolerance d>5.0 ±0.076mm
0.3<d≤5.0 ±0.05mm
d≤0.3 ±0.08mm
Min finished hole size 0.15mm
Hole copper thickness ≥20um
Min track width, spacing 0.05mm ×0.05mm
Profile size ±0.1mm ±0.05mm
Profile Routing,Punch,Cut,V-cut,Chanfer
Surface finish Immersion Gold:0.025~0.075um
Gold finger:≥0.13 um ≥1.0 um
OSP:0.2-0.5µm
HAL:5~20 um
LEADFREE HAL:5~20 um
Surface plating Solder mask: Black Green White Red Thickness≥17 um,Block,BGA
Character : Black Yellow Green White style: Highness≥0.0.625mm Width≥0.125mm
Ppeelable mask: red bule thickness≥300 um
Carbonink : Black thickness≥25 um Highness≥0.30mm Width≥0.3mm

Application
High Frequency Singer Board PCB is applied to Touch screen, LED display soft board,Tablet antenna soft board.

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