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Shenzhen Found Printed Circuit Board Co., Ltd.
Shenzhen Found Printed Circuit Board Co., Ltd.
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Fr4 Pcb Material Data Sheet And Printed Circuit Board Assembly Multi Color

Shenzhen Found Printed Circuit Board Co., Ltd.

Fr4 Pcb Material Data Sheet And Printed Circuit Board Assembly Multi Color

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Brand Name : Found

Model Number : Found163

Certification : UL:E361831

Place of Origin : China

MOQ : 1PC

Price : Negotiatable

Payment Terms : T/T

Supply Ability : 100000PC

Delivery Time : 2-8 days

Packaging Details : Vacuum packin

Copper thickness : 1oz,1/2OZ 1OZ 2OZ 3OZ,1 Oz,2oz,1.5oz

Base material : FR-4,CEM-1,Aluminium,PCB Circuit Board,FR-4/Cluminum/Ceramic/CEM-3/RF-1

Min. line spacing : 0.1mm4mil),0.003",4mil,0.1mm,0.075mm =3mil

Board thickness : 1.6mm,1.6mm-3.2mm,0.8mm,0.3~2.5mm,0.4~3mm

Surface finishing : HASL,Immersion Gold,OSP,HASL Lead Free,ENIG

Product name : Printed Circuit Board,Multilayer PCB,fr4 double sided pcb smt assembly motor control board,LED PCB Board

Solder mask : green,Green/Blue/Black/Red,Green. Red. Blue.,Yellow

Material : KB Class A Laminate FR4,CEM3 Rogers,Fr4 94v0,FR4 CEM1 CEM3 Aluminum,FR4 CEM1 CEM3 Hight TG

Color : Green,Blue on your request,yellow,green black bule white,Green/Blue/Red/White/Yellow/Black/Matt Black

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fr4 pcb material data sheet and printed circuit board assembly


PCB DescriptionOur PCB Board Capability
PCB Surface Finisheselectrolytic nickel-gold,
HASL(Lead Free, ENIG (Electroless Nickel/Immersion Gold, Carbon Ink, Golden Fingers, OSP (Entek, Immersion Tin, Immersion Silver
PCB Max. Size1200mm×600mm
PCB Min. Size5mm×5 mm
Bow & Twist ToleranceSingle Side≤1.0%,Double Side≤0.7%, Muti-Layer≤0.5%
Min. Board Thickness & Tolerance0.2mm±0.08mm
PCB Min. trace/spacingTin board:0.2mm±20%(8mil±0%)
gold board:0.075mm±20%(3mil±0%)
Copper to Board Edge Spacing0.5mm(20mil)
Hole to Trace Spacing0.3mm(12mil)
Min. Hole Diameter0.2mm±.076mm(8mil±3mil)
Min. Hole Clearance0.4mm±.076mm(16mil±3mil)
Copper Thickness on Hole Wall20-25um(0.79mil-1.0mil)
Hole Location Tolerance±0.076mm(l±3mil)
Min Diameter of Punching HoleFR-4 board thickness≤1.0mm(40mil):1.0mm(40mil)
FR-4 board thickness 1.2-3.0mm(48-120mil):1.5mm(60mil)
PCB Min. Punching SlotFR-4 CEM-3 board thickness≤1. 0mm(40mil):0.8 mm×0.8 mm(32mil×32mil)
FR-4 board thickness1.2-3.0mm(48-120mil): 1.0 mm×1.0 mm(40mil×40mil)
Trace width variation±0.076mm(±3mil)
Outline ToleranceRouting:±0.1mm (±4mil) ,Punching:±0.05mm (±2mil)
V-CUT Registration Tolerance±0.2mm (±8mil)
PCB BOARD TypeSingle-sided, double-sided, multi-layer
Major MaterialFR-4, CEM-1,CEM-3, high frequency laminates, Aluminum, NiFe-based, copper base
PCB BOARD Thickness0.2-3.5mm
Base Copper Thickness11um 35um 70um 105um
Max. aspect ratio(board thickness: hole size)8:1
V-Cut Angle Tolerance±5°
V-Cut Board Thickness0.4mm -3.2mm(16mil -128mil)
Min SMT Pitch0.3mm(12mil)
Min. Component mark0.15mm(6mil)
Min. width of annular ring(finished)0.15mm(6mil)/side
Min pad opening0.076mm(3mil)
Min S/M Bridge±0.076mm(±3mil)
carbon ink board manufacturing capability:1.Impedance Control:20K±10% 2.Hardness:6H 3.bearable friction times :above 200000 times
Technology
Min trace/space(inner/external)3/3 mil0.075/0.075mm
Min drill size for through holedrill 8.0 mil0.20mm
Laser dill4 mil0.1mm
Copper Foil Thickness17-210um
Inner Core Thickness±0.08mm
Tolerance of total board thickness±0.015mm
Max .Unit Area700-800
Min. Unit Area2-5mm
Max Layer1-18 Layers
Surface Treatment
Solder Coating Thickness Sn4-20um
Cobalt/ Gold plating, Hard Gold ThicknessNi:5-10umAu:0.05-0.20um
Gold/Nickel Plating ThicknessNi:5-10umAu:0.05-0.15um
OSP Coating Thickness0.2-0.5um
Electroness Au ThicknessNi:3-15umAu:0.025-0.10mm
Chem .Tin ThicknessSn:0.8-5um
Producting Capacityeach day :800-100m2
Aspect Ratio6:01:00
Hole Registration0.004" (0.1mm)

Features and benefits
1. The dielectric constant (DK) is low and stable, so the signal transmission is good without delay.
2. The characteristic of low dielectric loss makes the signal loss at a lower level, which makes the signal
transmission of the whole equipment excellent.
3. Delamination of copper foil will not be caused by the change of cold and heat due to the consistency
with the thermal expansion coefficient of copper foil.
4. Immersion gold has excellent surface planarity, particularly helpful for PCBs with BGA packages or even CSP mounted components to reduce failure rate during assembly and soldering.
5. UL, ISO certified PCB manufacturing factory.
6. Make delivery on time keeping 98% on-time-delivery rate.
7. Eligible products rate of first production: >95%
8. Experienced sales persons provide skilled customer services.
9. Fast and flexible to save the time of production from prototype to standard production


Trade Terms:
1. Payment: T/T in advance (Western Union , payple is welcomed)
2. Production lead time 100PCS: 5-7days, 500~1000PCS: 7-10days, above 1000PCS 15-20days.
3. Sample can be delivered in 3days
4. Shipping freight are quoted under your requests
5. Shipping port: Shen zhen,Mainland China
6. Discounts are offered based on order quantities
7. MOQ: 1PCS
Package &Shipping Methods:
1.Vacuum package with silica gel, Carton box with packing belt.
2. By DHL, UPS, FedEx, TNT
3. By EMS (Usually for Russia Clients)
4. By sea for mass quantity according to customer's requirement


Product Tags:

fr4 double sided pcb

      

fr4 copper clad sheet

      
Quality Fr4 Pcb Material Data Sheet And Printed Circuit Board Assembly Multi Color for sale

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